Method of pasting film and display device

ABSTRACT

An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a first member including a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source, and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.

BACKGROUND ART

The present invention relates to a vacuum suction control mechanism apparatus, a film bonding apparatus comprising a vacuum suction mechanism, a film bonding method using a film bonding apparatus, and a display apparatus manufactured by a film bonding method.

A display apparatus using liquid crystal or the like is formed by filling liquid crystal or the like between a pair of substrates such as glasses comprising electrodes for display and bonding a polarization film on a surface of one of the substrates.

Apparatuses for bonding a film on a substrate comprise various types of structures. Some apparatuses use a bonding unit (bonding head) comprising suction holes formed in a surface thereof as shown in Patent Document 1.

Specifically, as described at paragraph [0028] of Japanese laid-open patent publication No. 2001-42315 (Patent Document 1), a suction surface of a film support 22, which comprises a curved shape, is formed by a plate comprising a plurality of suction holes defined therein. Suction valves are connected to the suction holes.

As described at paragraph [0037], the film support 22 is rotated and moved toward a supply device A, which supplies a film. The suction valves are switched so as to exhaust air through the suction holes, thereby attracting the film.

After the attraction of the film, the film support 22 is rotated and moved above a substrate (liquid crystal panel). Then the film is bonded to the substrate.

Thereafter, the suction valves are switched so as to supply air, thereby releasing the suction. Thus, the film support 22 is separated from the substrate.

Furthermore, as described at paragraph [0046], air is blown to the film at the time of the bonding in order to prevent a positional deviation when the film is bonded to the substrate.

DISCLOSURE OF INVENTION

However, in a mechanism thus using vacuum suction to bond a film, suction of a suction hole is controlled with a suction valve. Therefore, it is necessary to provide valves so as to correspond to the number of the suction holes. Thus, the structure is problematically complicated.

Furthermore, a structure for blowing air at the time of attraction or bonding complicates the structure of an apparatus. Moreover, the air blow may cause dust or air to be mixed on a bonding surface. Thus, there is a problem that the bonding accuracy may be lowered.

The present invention has been made in view of the above problems. It is an object of the present invention to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure.

In order to achieve the aforementioned object, a first invention provides a vacuum suction control mechanism apparatus comprising: a first member comprising a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source; and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.

A second invention provides a film bonding apparatus comprising the vacuum suction control mechanism apparatus according to the first invention.

A third invention provides a film bonding method comprising: bonding a film to a bonding object with use of the film bonding apparatus according to the second invention.

A fourth invention provides a display apparatus manufactured by bonding a film to a bonding object with use of the film bonding method according to the third invention.

Effects of the Invention

According to the present invention, there can be provided a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a film bonding apparatus 1;

FIG. 2 is a diagram as viewed along direction 2 of FIG. 1;

FIG. 3A is a cross-sectional view taken along line 3A-3A of FIG. 2;

FIG. 3B is a view showing a variation of FIG. 3A;

FIG. 3C is a view showing a variation of FIG. 3A;

FIG. 4 is a side view showing a bonding head 3;

FIG. 5A is a side view showing a base member 5;

FIG. 5B is a rear view of FIG. 5A;

FIG. 6 is a view showing a method attracting a film 17 to the bonding head 3 with use of the film bonding apparatus 1;

FIG. 7 is a view showing a method attracting the film 17 to the bonding head 3 with use of the film bonding apparatus 1;

FIG. 8 is a view showing a method attracting the film 17 to the bonding head 3 with use of the film bonding apparatus 1;

FIG. 9 is a view showing a method bonding the film 17 onto a glass substrate 19 with use of the film bonding apparatus 1;

FIG. 10 is a view showing a method bonding the film 17 onto the glass substrate 19 with use of the film bonding apparatus 1;

FIG. 11 is a view showing a method bonding the film 17 onto the glass substrate 19 with use of the film bonding apparatus 1; and

FIG. 12 is a view showing a display apparatus 27 manufactured by bonding a polarization plate 25 to liquid crystal panels 26 with use of the film bonding apparatus 1.

DESCRIPTION OF REFERENCE NUMERALS

1 Film bonding apparatus

3 Bonding head

3 a End face

3 b Surface

3 c Head shaft hole

5 Base member

5 a Base shaft hole

7 Shaft

9 Suction portion

9 a Suction hole

11 Groove

13 Hole

15 Bonding surface plate

17 Film

19 Glass substrate

19 a Mount

23 Piece

25 Polarization plate

26 Liquid crystal panel

27 Display apparatus

BEST MODE FOR CARRYING OUT THE INVENTION

A preferred embodiment of the present invention will be described below with reference to the drawings.

First, an arrangement of a film bonding apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3C.

Here, the film bonding apparatus 1 is illustrated as an example of a film bonding apparatus for bonding a film of a flexible polarization film to a bonding object of a glass substrate for a liquid crystal panel.

As shown in FIGS. 1 to 3A, the film bonding apparatus 1 as a vacuum suction control mechanism apparatus comprises a bonding head 3, a base member 5, a shaft 7, and a bonding surface plate 15.

As shown in FIGS. 1 to 3A, the film bonding apparatus 1 includes, as a first member, the cylindrical bonding head 3 for attracting a film 17, which will be described later. The diameter of the bonding head 3 is selected properly depending upon the dimension of the film 17.

The material of the bonding head 3 is not limited to a specific one. Nevertheless, at least a portion contacting the film 17 is preferably formed of a material comprising elasticity, more preferably rubber or resin comprising a hardness of 20 to 40 by the standard SRIS 0101.

If the bonding head 3 is formed of such a material, bonding pressures are equally generated when the film 17 is bonded onto the glass substrate 19. Therefore, the glass is prevented from being broken because of local concentration of the bonding pressures, and the thickness of the glass substrate 19 can thus be reduced.

Furthermore, since the bonding pressures are equally generated, air bubbles are prevented from being mixed on a bonding surface at the time of bonding. Therefore, low-grade glass comprising poor flatness can be used as a material for the glass substrate 19.

The disk-like base member 5 is provided as a second member on an end face 3 a (side surface) of the bonding head 3.

The base member 5 may be provided on other surfaces, not on the side surface of the bonding head 3.

A structure for preventing leakage of air at the time of pressure reduction, which will be described later, is provided between the bonding head 3 and the base member 5. In order to improve the airtightness and control leakage of air, a seal, which is not shown, may be provided as needed.

The film bonding apparatus 1 further includes the shaft 7 provided at the center of axes of the bonding head 3 and the base member 5.

The bonding head 3 is rotatable about the shaft 7 in directions C1 and C2 of FIG. 2.

On the other hand, the base member 5 does not rotate.

Furthermore, the bonding head 3, the base member 5, and the shaft 7 can be moved jointly in directions E1, E2, E3, and E4 of FIG. 2 by an actuator, which is not shown.

Moreover, the flat bonding surface plate 15 for holding a bonding object is provided so as to face a surface 3 b of the bonding head 3.

The bonding surface plate 15 is movable in directions D1 and D2 of FIG. 2. The bonding surface plate 15 may be movable in a vertical direction of FIG. 2 or in a θ-direction (a direction for adjusting the horizontality of the bonding surface plate 15).

The material of the bonding surface plate 15 is not limited to a specific one. Nevertheless, the bonding surface plate 15 is preferably formed of a material comprising elasticity, more preferably rubber or resin comprising a hardness of 20 to 40 by the standard SRIS 0101, as with the bonding head 3.

If the bonding surface plate 15 is formed of such a material, it is possible to attain the same advantages as in the case where the bonding head 3 is formed of such a material.

Next, the detailed structures of the bonding head 3 and the base member 5 will be described with reference to FIGS. 3A to 5B.

As shown in FIGS. 3A and 4, suction holes 9 a, 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g are formed in the surface 3 b of the bonding head 3.

The suction holes 9 a, 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g extend through the bonding head 3 from the end face 3 a (side surface) to the surface 3 b. In FIGS. 3A and 4, a portion of the suction hole extending to the surface 3 b is illustrated as a suction portion 9 comprising a widened shape. However, the shape of the suction portion 9 can be selected properly depending upon the film.

Furthermore, as shown in FIG. 3B, a piece 23 formed of a porous sheet of metal, resin, sponge, or the like may be provided in the suction portion 9.

Provision of the piece 23 formed of a porous sheet or the like can prevent a mark of the hole from being transferred to the film 17 at the time of attraction of the film, which will be described later.

For example, the piece 23 comprises a hole density such that holes comprising a diameter of 1 mm are formed at a pitch of 2 mm.

Meanwhile, the suction holes 9 a, 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g (on the surface of the end face 3 a from which they extend) are arranged (in an arcuate manner) so as to correspond to the shape of a groove 11, which will be described later.

Furthermore, a head shaft hole 3 c through which the shaft 7 passes is formed at the center of the bonding head 3.

As shown in FIGS. 3A, 5A, and 5B, the base member 5 comprises a groove 11 formed in a surface facing the bonding head 3.

The groove 11 comprises a shape corresponding to the shape of the surface 3 b of the bonding head 3, i.e., an arcuate shape.

Furthermore, the base member 5 comprises a hole 13 extending through the base member 5 from the groove 11 to a surface of the base member 5 opposite to the surface facing the bonding head 3.

As shown in FIG. 3C, a hole 13 a may be formed so as to extend to a side surface of the base member 5.

A decompression source such as a vacuum pump, which is not shown, is connected to the hole 13.

The position of the hole 13 can be selected properly based on a positional relationship with the decompression source.

Furthermore, a base shaft hole 5 a through which the shaft 7 passes is formed at the center of the base member 5.

Here, as shown in FIG. 3A, when the groove 11 communicates with the suction hole 9 a, the hole 13 is connected to the suction hole 9 a through the groove 11, so that the suction hole 9 a is connected to the decompression source.

If the decompression source is operated in this state, air in the suction hole 9 a is exhausted so that the suction portion 9 can attract a film.

Meanwhile, when the bonding head 3 is rotated in the direction C1 or C2 of FIG. 2 from the state of FIG. 3A so as to move the groove 11 to a position at which the groove 11 does not communicate with the suction hole 9 a, the communication between the hole 13 and the suction hole 9 a is disconnected. Thus, the communication between the suction hole 9 a and the decompression source is disconnected.

In this state, air in the suction hole 9 a is not exhausted. Therefore, the suction portion 9 cannot attract a film. Accordingly, if the suction portion 9 has already attracted a film, the film is separated from the suction hole 9 a.

The suction holes 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g are configured in the same manner as the suction hole 9 a.

Thus, in the film bonding apparatus 1, a desired number of the suction holes among the suction holes 9 a, 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g are connected to or disconnected from the decompression source by relative positions between the groove 11 and the suction holes 9 a, 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g.

Specifically, the groove 11 of the base member 5 connects suction holes, the number of which corresponds to relative positions between the groove 11 and the suction holes 9 a, 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g, to the decompression source.

Next, a method bonding the film 17 onto the glass substrate 19 with use of the film bonding apparatus 1 will be described with reference to FIGS. 6 to 11.

Bonding of the film 17 onto the glass substrate 19 with the film bonding apparatus 1 requires a process of attracting the film 17 to the bonding head 3 and a process of bonding the film 17 on the bonding head 3 to the glass substrate 19.

First, the process of attracting the film 17 to the bonding head 3 will be described with reference to FIGS. 6 to 8.

The film 17 is first placed on the bonding surface plate 15 and held in a flat state.

The film 17 has been bonded to a mount 19 a. An adhesive layer, which is not shown, is provided on a surface of the film 17 that contacts the mount 19 a.

Available known member can be used holding the film 17. For example, the film 17 is held by vacuum suction or a clamp.

Then the bonding head 3 is rotated relative to the base member 5 in the direction C1 or C2 of FIG. 2. As shown in FIG. 6, the bonding head 3 is positioned so that the groove 11 communicates only with the suction hole 9 g.

In this state, the bonding head 3 (along with the base member 5 and the shaft 7) is moved in the direction E2, E3, or E4 of FIG. 2 so as to bring the suction hole 9 g into contact with a surface of a left edge of the film 17. Then the decompression source, which is not shown, is operated.

During the movement, the position of the edge of the film 17 is measured by a sensor, a camera, or the like, which is not shown. Based on the measured position, an actuator, which is not shown, is operated to move the bonding head 3 (along with the base member 5 and the shaft 7).

The bonding surface plate 15, rather than the bonding head 3, may be moved to bring the suction hole 9 g into contact with the surface of the left edge of the film 17.

Since the groove 11 communicates only with the suction hole 9 g, only air in the suction hole 9 g is exhausted. Thus, the surface of the edge of the film 17 is attracted to the surface 3 b of the bonding head 3.

The suction force depends upon the surface roughness and the flexibility of the film 17. In the case of a polarization film for a liquid crystal panel as in the present embodiment, it is preferable to adjust a suction force in a range of about 2.0×10⁴ Pa to about 4.9×10⁴ Pa.

Next, the bonding head 3 is rotated from the state of FIG. 6 in the direction C1 of FIG. 6. Furthermore, the bonding surface plate 15 is moved toward the direction D2 of FIG. 6 in synchronism with the rotation of the bonding head 3.

The suction holes 9 f, 9 e, 9 d, 9 c, 9 b, and 9 a are brought into contact with the film 17 in the order named. The suction holes communicate with the groove 11 and are connected to the decompression source in the order in which they have been brought into contact with the film 17. Sequentially, air is exhausted, so that the suction holes attract the film 17.

In other words, the film bonding apparatus 1 attracts the film 17 merely by bringing the bonding head 3 into contact with the film 17 and rotating the bonding head 3.

For example, FIG. 7 shows the attraction in progress. The suction holes 9 g, 9 f, 9 e, and 9 d communicate with the groove 11 and are connected to the decompression source. Air in the suction holes 9 g, 9 f, 9 e, and 9 d is drawn, so that the suction holes 9 g, 9 f, 9 e, and 9 d attract the film 17.

Those suction holes have been brought into contact with the film 17. Those suction holes communicate with the groove 11 in the order in which they have been brought into contact with the film 17. Thus, the suction holes 9 g, 9 f, 9 e, and 9 d attract the film 17.

As shown in FIG. 8, when all of the suction holes communicate with the groove 11, the bonding head 3 (along with the base member 5 and the shaft 7) is moved toward the direction E1 of FIG. 2 and separated from the bonding surface plate 15.

In order to thus attract the film 17 with the film bonding apparatus 1, relative positions between the suction holes and the groove 11 are arranged such that the suction holes communicate with the groove 11 and are connected to the decompression source for attracting the film 17 in the order in which they have been brought into contact with the film 17.

With such an arrangement, the film 17 can be attracted to the bonding head 3 with accuracy without deviation at the time of the attraction.

In the above process, the film 17 is peeled from the mount 19 a at the same time it is attracted. However, the film 17 may be attracted together with the mount 19 a, and the mount 19 a may be peeled later.

Furthermore, in the above process, the bonding surface plate 15 holds the film 17 to be attracted. However, the film 17 to be attracted may be held on a surface plate other than the bonding surface plate 15.

Next, a process of bonding the attracted film 17 onto the glass substrate 19 will be described with reference to FIGS. 9 to 11.

First, as shown in FIG. 9, the glass substrate 19 is held on the bonding surface plate 15. The same holding members holding the film 17 may be used.

For the bonding surface plate 15, a common bonding surface plate may be used both holding the film 17 when the bonding head 3 attracts the film 17 and for holding the glass substrate 19 as described here. Alternatively, separate bonding surface plates may be used.

Next, the bonding head 3 (along with the base member 5 and the shaft 7) that has attracted the film 17 is moved in the directions E2, E3, and E4 of FIG. 2 so that the suction hole 9 a is brought into contact with a surface of the glass substrate 19 at a desired bonding location.

During the movement, the position of the edge of the glass substrate 19 is measured by a sensor, a camera, or the like, which is not shown. Based on the measured position, an actuator, which is not shown, is operated to move the bonding head 3 (along with the base member 5 and the shaft 7).

The bonding surface plate 15, rather than the bonding head 3, may be moved to bring the suction hole 9 a into contact with the desired bonding location of the glass substrate 19.

Then the bonding head 3 is rotated in the direction C2. Furthermore, the bonding surface plate 15 is moved toward the direction D1 of FIG. 9 in synchronism with the rotation of the bonding head 3.

The suction holes 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g are brought into contact with the glass substrate 19 via the film 17 in the order named. The communications of the suction holes 9 b, 9 c, 9 d, 9 e, 9 f, and 9 g with the groove 11 are cut off in that order.

In other words, the communications of the suction holes with the groove 11 are cut off in the order in which the suction holes have been brought into contact with the glass substrate 19. The suction holes are disconnected from the decompression source, losing a suction force. Therefore, the suction holes are separated from the film 17.

Accordingly, the film 17 is bonded to the glass substrate 19 from a portion separated from the suction holes by release of the attraction.

For example, FIG. 10 shows the bonding in progress. The suction holes 9 g, 9 f, 9 e, and 9 d communicate with the groove 11 and are connected to the decompression source. Air in the suction holes 9 g, 9 f, 9 e, and 9 d is drawn, so that the suction holes 9 g, 9 f, 9 e, and 9 d attract the film 17.

Those suction holes have not been brought into contact with the glass substrate 19 via the film 17. The communications of those suction holes with the groove 11 are cut off so that the suction holes lose a suction force to the film 17 in the order in which the suction holes have been brought into contact with the glass substrate 19.

A suction force prior to the cut-off is maintained immediately after the communication has been cut off. Therefore, the film 17 is held on the bonding head 3 until it is bonded.

As shown in FIG. 11, when the bonding of the film 17 is completed, the rotation of the bonding head 3 and the suction of the decompression source are stopped.

Then the bonding head 3 (along with the base member 5 and shaft 7) is moved upward in FIG. 2 and separated from the bonding surface plate 15.

Thus, the film 17 is bonded to the glass substrate 19, and a liquid crystal panel is completed.

For reference purposes, FIG. 12 shows a display apparatus 27 manufactured by bonding a polarization plate to liquid crystal panels with use of the film bonding apparatus 1.

In the display apparatus 27 shown in FIG. 12, a polarization plate 25 is bonded to liquid crystal panels 26 with use of the film bonding apparatus 1.

As described above, when the film 17 is bonded to the glass substrate 19, the communications of the suction holes with the groove 11 are cut off in the order in which the suction holes have been brought into contact with the glass substrate 19 via the film 17. Thus, the suction holes are separated from the film 17. Specifically, the communications are cut off at (or near) a portion at which the film 17 is brought into contact with the glass substrate.

Therefore, deviation of the film 17 or mixing of air or dust is prevented during the bonding. Accordingly, the film 17 can be bonded with accuracy.

Thus, according to the present embodiment, the film bonding apparatus 1 includes a bonding head 3 comprising a plurality of suction holes and a base member 5 comprising a groove 11. The individual suction holes are connected to or disconnected from a decompression source by relative positions between the groove 11 and the individual suction holes.

Therefore, the film bonding apparatus 1 does not require a plurality of valves for suction control. Thus, the film bonding apparatus 1 comprises a simple structure.

Furthermore, no air needs to be blown. Therefore, deviation of the film 17 or mixing of air or dust is prevented during the bonding. Accordingly, the film 17 can be bonded with accuracy.

Moreover, when the film bonding apparatus 1 is used to bond the film 17 onto the glass substrate 19 for manufacturing a display apparatus, the quality of the manufactured display apparatus can be improved.

Example

The present invention will specifically be described below based on an example.

In an example of the present invention, a film bonding apparatus 1 shown in FIG. 1 was prepared. A polarization film was bonded to a glass substrate 19 comprising a diagonal of 2 inches to 60 inches.

The polarization film used for bonding had a surface roughness such that 0.3 μm≦Ra≦3.0 μm. The thickness of the polarization film was in a range of from 0.1 mm to 0.5 mm.

Furthermore, a suction force of each suction hole at the time of bonding was set in a range of from about 2.0×10⁴ Pa to about 4.9×10⁴ Pa.

As a result, it was confirmed that the polarization film did not fall off from the bonding head 3 during the bonding and that there is no trouble in the slide of the polarization film at the time of the bonding. In the aforementioned embodiment, the present invention is applied to an apparatus for bonding a polarization film to a liquid crystal display substrate. However, the present invention is not limited to that example and is applicable to any apparatus for bonding a film to a bonding object.

Furthermore, in the above embodiment, the base member 5 is not rotated while the bonding head 3 is rotated. Conversely, the base member 5 may be rotated.

Moreover, the bonding head 3 comprises a cylindrical shape in the above embodiment. However, the shape of the bonding head 3 is not limited to a cylindrical shape. The bonding head 3 may comprise any shape as long as a surface with suction holes comprises a curved shape.

Furthermore, according to another embodiment of the vacuum suction control mechanism apparatus of the present invention, the surface of the first member may comprise a curved shape, the second member may include a groove provided on a surface of the second member facing the first member, the groove may comprise a shape corresponding to the curved shape, the second member may comprise a hole extending through the second member from the groove to an exterior of the second member, the hole may be connected to the decompression source, the plurality of suction holes may be arranged to comprise an arrangement shape corresponding to the shape of the groove, the first member or the second member may be movable along a curved surface of the curved shape, and the groove of the second member may be moved relative to the first member so that the suction holes that communicate with the groove are connected to the decompression source by movement of the first member or the second member.

According to still another embodiment of the vacuum suction control mechanism apparatus of the present invention, the first member may comprise a cylindrical shape, the groove may comprise an arcuate shape, the plurality of suction holes may be arranged in an arcuate manner, the first member or the second member may be rotatable about an axis of the cylinder, and the groove of the second member may be moved relative to the first member so that the suction holes that communicate with the groove are connected to the decompression source by rotation of the first member or the second member about the axis of the cylinder.

According to another embodiment of the vacuum suction control mechanism apparatus of the present invention, the plurality of suction holes may extend through the first member from a side surface to a surface of the first member.

According to still another embodiment of the vacuum suction control mechanism apparatus of the present invention, the first member may comprise a bonding head configured to hold a film, and the second member may comprise a base member provided on a side surface of the bonding head.

According to another embodiment of the vacuum suction control mechanism apparatus of the present invention, the decompression source comprises a vacuum pump, for example.

According to still another embodiment of the vacuum suction control mechanism apparatus of the present invention, the vacuum suction control mechanism apparatus may further comprise a bonding surface plate configured to hold a bonding object, and the bonding surface plate may be provided so as to face the surface of the first member.

According to another embodiment of the vacuum suction control mechanism apparatus of the present invention, the first member and/or the bonding surface plate may comprise elasticity

Furthermore, according to another embodiment of the film bonding apparatus of the present invention, the vacuum suction control mechanism apparatus may be an apparatus for attracting and bonding an optical film.

Moreover, according to still another embodiment of the film bonding apparatus of the present invention, the bonding surface plate may comprise holding member holding the bonding object in a flat state.

Furthermore, according to another embodiment of the display apparatus of the present invention, the film may comprise flexibility.

Moreover, according to still another embodiment of the display apparatus of the present invention, the film may be an optical film, and the bonding object may be a substrate that allows visible light to pass therethrough.

Furthermore, according to another embodiment of the display apparatus of the present invention, the optical film may be a polarization film or a retardation film.

Moreover, according to still another embodiment of the display apparatus of the present invention, the film may be a protective film.

Furthermore, according to another embodiment of the display apparatus of the present invention, the bonding object may be formed of glass.

In a vacuum suction control mechanism apparatus and a film bonding method according to an embodiment of the present invention, the vacuum suction control mechanism apparatus comprises a first member comprising suction holes and a second member for connecting the suction holes to a decompression source, and the second member connects some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.

Accordingly, at the time of bonding of a film, attraction can sequentially be released at a portion that has been bonded. Thus, a film can accurately be bonded to a bonding object with a simple structure without deviation of the film or mixing of dust or air.

Furthermore, since a display apparatus according to an embodiment of the present invention is manufactured by using a film bonding method according to an embodiment of the present invention, the quality of the display apparatus can be improved.

This application claims the benefit of priority from Japanese patent application No. 2007-228892, filed on Sep. 4, 2007, the disclosure of which is incorporated herein in its entirety by reference. 

1. A film bonding method, comprising: bonding a film to a bonding object with use of a film bonding apparatus comprising a vacuum suction control mechanism apparatus, the vacuum suction control mechanism apparatus comprising: a first member comprising a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source; and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.
 2. A display apparatus manufactured by bonding a film to a bonding object with use of the film bonding method as recited in claim
 1. 3. The display apparatus as recited in claim 2, wherein the film has flexibility.
 4. The display apparatus as recited in claim 2, wherein: the film is an optical film, and the bonding object is a substrate that allows visible light to pass therethrough.
 5. The display apparatus as recited in claim 4, wherein the optical film is a polarization film or a retardation film.
 6. The display apparatus as recited in claim 2, wherein the film is a protective film.
 7. The display apparatus as recited in claim 4, wherein the bonding object is formed of glass. 